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| LZ2426J LZ2426J DESCRIPTION Dual-power-supply (5 V/12 V) Operation 1/4-type B/W CCD Area Sensor with 320 k Pixels PIN CONNECTIONS 14-PIN HALF-PITCH WDIP TOP VIEW The LZ2426J is a 1/4-type (4.5 mm) solid-state image sensor that consists of PN photo-diodes and CCDs (charge-coupled devices) driven by dualpower-supply. With approximately 320 000 pixels (542 horizontal x 582 vertical), the sensor provides a stable high-resolution B/W normal or mirror image. ORS 1 GND 2 OS 3 14 OFD 13 OTG 12 OV2 11 OV1 10 OV4 9 OV3 8 OH1 FEATURES * Number of effective pixels : 512 (H) x 582 (V) * Number of optical black pixels - Horizontal : 2 front and 28 rear * Pixel pitch : 7.2 m (H) x 4.7 m (V) * Low fixed-pattern noise and lag * No burn-in and no image distortion * Blooming suppression structure * Built-in output amplifier * Built-in pulse mix circuit * Variable electronic shutter (1/50 to 1/10 000 s) * Normal or mirror image output available from common output pin * Compatible with CCIR standard * Package : 14-pin half-pitch WDIP [Plastic] (WDIP014-P-0400A) Row space : 10.16 mm OD 4 OH2B 5 OH2 6 OH1B 7 (WDIP014-P-0400A) PRECAUTIONS * The exit pupil position of lens should be more than 20 mm from the top surface of the CCD. * Refer to "PRECAUTIONS FOR CCD AREA SENSORS" for details. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 1 LZ2426J PIN DESCRIPTION SYMBOL OD OS ORS OV1, OV2, OV3, OV4 OH1, OH2, OH1B, OH2B OTG OFD GND PIN NAME Output transistor drain Output signals Reset transistor clock Vertical shift register clock Horizontal shift register clock Transfer gate clock Overflow drain Ground 1 NOTE NOTE : 1. OV1-OV4 : Input the clock through a 0.1 F capacitor. ABSOLUTE MAXIMUM RATINGS PARAMETER Output transistor drain voltage Overflow drain voltage Reset gate clock voltage Vertical shift register clock voltage Horizontal shift register clock voltage Transfer gate clock voltage Storage temperature Ambient operating temperature SYMBOL VOD VOFD VORS VOV VOH VOTG TSTG TOPR RATING 0 to +15 0 to +30 (TA = +25 C) UNIT V V V V V V C C -0.3 to +15 0 to +7.5 -0.3 to +7.5 -0.3 to +15 -40 to +85 -20 to +70 2 LZ2426J RECOMMENDED OPERATING CONDITIONS PARAMETER Ambient operating temperature Output transistor drain voltage Overflow drain voltage Ground Transfer gate clock Vertical shift register clock Horizontal shift register clock When DC is applied When pulse is applied p-p level LOW level HIGH level p-p level LOW level HIGH level LOW level HIGH level SYMBOL TOPR VOD VOFD VOOFD GND VOTGL VOTGH VOV1, VOV2 VOV3, VOV4 VOH1L, VOH2L VOH1BL, VOH2BL VOH1H, VOH2H VOH1BH, VOH2BH VORSL VORSH fOV1, fOV2 fOV3, fOV4 fOH1, fOH2 fOH1B, fOH2B fORS tw1, tw2 8.0 MIN. 12.0 2.7 12.0 -0.05 12.0 4.7 -0.05 4.7 0.0 VOD - 4.5 15.63 9.66 9.66 13.0 18.0 12.5 0.0 0.0 12.5 5.0 0.0 5.0 TYP. 25.0 12.5 MAX. 13.0 12.0 13.0 0.05 13.0 5.5 0.05 5.5 VOD - 9.0 9.5 UNIT C V V V V V V V V V V V kHz MHz MHz ns 3 1 2 NOTE Reset gate clock Vertical shift register clock frequency Horizontal shift register clock frequency Reset gate clock frequency Horizontal shift register clock phase NOTES : 1. When DC voltage is applied, shutter speed is 1/50-second. 2. When pulse is applied, shutter speed is less than 1/50-second. 3. OH1, OH2 OH1B, OH2B : Normal image output mode OH1B, OH2B : Mirror image output mode tw1 tw2 * To apply power, first connect GND and then turn on VOD and then turn on other powers and pulses. Do not connect the device to or disconnect it from the plug socket while power is being applied. 3 LZ2426J CHARACTERISTICS (Drive method : Field accumulation) (TA = +25 C, Operating conditions : The typical values specified in "RECOMMENDED OPERATING CONDITIONS". Color temperature of light source : 3 200 K, IR cut-off filter (CM-500, 1 mmt) is used.) PARAMETER Standard output voltage Photo response non-uniformity Saturation output voltage Dark output voltage Dark signal non-uniformity Sensitivity Smear ratio Image lag Blooming suppression ratio Output transistor drain current Output impedance SYMBOL VO PRNU VSAT VDARK DSNU R SMR AI ABL IOD RO 1 000 4.0 400 8.0 mA $ MIN. TYP. 150 MAX. 15 450 0.5 0.5 400 -84 1.0 UNIT mV % mV mV mV mV dB % NOTE 2 3 4 1, 5 1, 6 7 8 9 10 NOTES : * VOFD should be adjusted to the minimum voltage such that ABL satisfy the specification, or to the value displayed on the device. 1. TA = +60 C 2. The average output voltage under uniform illumination. The standard exposure conditions are defined as when Vo is 150 mV. 3. The image area is divided into 10 x 10 segments under the standard exposure conditions. Each segment's voltage is the average output voltage of all pixels within the segment. PRNU is defined by (Vmax - Vmin)/Vo, where Vmax and Vmin are the maximum and minimum values of each segment's voltage respectively. 4. The image area is divided into 10 x 10 segments. Each segment's voltage is the average output voltage of all pixels within the segment. VSAT is the minimum segment's voltage under 10 times exposure of the standard exposure conditions. 5. The average output voltage under non-exposure conditions. 6. The image area is divided into 10 x 10 segments under non-exposure conditions. DSNU is defined by (Vdmax - Vdmin), where Vdmax and Vdmin are the maximum and minimum values of each segment's voltage respectively. 7. The average output voltage when a 1 000 lux light source with a 90% reflector is imaged by a lens of F4, f50 mm. 8. The sensor is exposed only in the central area of V/10 square with a lens at F4, where V is the vertical image size. SMR is defined by the ratio of the output voltage detected during the vertical blanking period to the maximum output voltage in the V/10 square. 9. The sensor is exposed at the exposure level corresponding to the standard conditions. AI is defined by the ratio of the output voltage measured at the 1st field during the non-exposure period to the standard output voltage. 10. The sensor is exposed only in the central area of V/10 square, where V is the vertical image size. ABL is defined by the ratio of the exposure at the standard conditions to the exposure at a point where blooming is observed. 4 LZ2426J PIXEL STRUCTURE OPTICAL BLACK (2 PIXELS) 512 (H) x 582(V) OPTICAL BLACK (28 PIXELS) 1 pin TIMING CHART (1st, 3rd FIELD) 623 HD VD OV1 OV2 OV3 OV4 OTG 580 582 + 581 1 + 2 3 + 4 5 + 6 7 + 8 VERTICAL TRANSFER TIMING 625 1 6 20 22 OS (2nd, 4th FIELD) 311 HD VD OV1 OV2 OV3 OV4 OTG 579 581 + + 580 582 1 2 + 3 4 + 5 6 + 7 318 332 OS 5 LZ2426J HORIZONTAL TRANSFER TIMING HD OH1 OH2 ORS OS ... 512 OB (28) 29 OV1 39 OV2 24 OV3 34 OV4 62 OOFD 72 64 54 59 49 PRE SCAN (4) OB (2) OUTPUT (512) 1 618, 1 24 60 84.5 (1st, 3rd FIELD) HD OV1 OV2 OV3 OV4 OTG 25.07 s (242 bits) 24 1 60 READOUT TIMING 618, 1 60 29 49 39 59 54 34 242 338 64 9.95 s (96 bits) 64.00 s (618 bits) (2nd, 4th FIELD) HD OV1 39 OV2 24 OV3 34 OV4 242 OTG 25.07 s (242 bits) 9.95 s (96 bits) 64.00 s (618 bits) 338 64 54 59 1 60 29 49 618, 1 60 6 LZ2426J (1st, 3rd FIELD) 623 HD VD OV1 OV2 OV3 OV4 OTG 578 580 582 + + 579 581 VERTICAL TRANSFER TIMING 625 1 6 20 22 1 + 2 3 + 4 5 + 6 OS (2nd, 4th FIELD) 311 HD VD OV1 OV2 OV3 OV4 OTG 577 579 581 + + + 578 580 582 1 2 + 3 4 + 5 318 332 OS HORIZONTAL TRANSFER TIMING 618, 1 HD OH1 OH2 ORS OS 1 9 OV1 19 OV2 4 OV3 14 OV4 42 OOFD 52 44 34 39 29 4 58.5 60 OB (2) PRE SCAN (4) OB (28) OUTPUT (512) 512 7 LZ2426J (1st, 3rd FIELD) HD OV1 OV2 OV3 OV4 OTG 23.00 s (222 bits) 4 1 60 READOUT TIMING 618, 1 9 29 19 39 34 24 44 222 318 60 9.95 s (96 bits) 64.00 s (618 bits) (2nd, 4th FIELD) HD OV1 19 OV2 4 OV3 14 OV4 222 OTG 23.00 s (222 bits) 9.95 s (96 bits) 64.00 s (618 bits) 318 44 34 39 1 9 29 60 618, 1 60 8 0.1 F 0.1 F 0.1 F 0.1 F 68 $ OTG OFD 1 000 pF OH1 OV3 OV2 OV1 OV4 390 $ TGX OV4 OV3 OV2 OV1 VCC 20 k$ 2.2 k$ 22 k$ 10 $ 0.1 F 2SC4716 1 M$ 14 13 12 11 10 (*1) * Example of drive circuit with LR38580 driver IC. 9 8 SYSTEM CONFIGURATION EXAMPLE LZ2426J 1 ORS GND 9 OFD 2 3 CCD OUT 4 OS OD 2SC4627 5 OH2B 6 OH2 7 OH1B ORS VOD 1 k$ OH1 OH1B OH2 OH2B (*1) OV1-OV4 : Input the clock through a 0.1 F capacitor. LZ2426J PACKAGES FOR CCD AND CMOS DEVICES PACKAGE 14 WDIP (WDIP014-P-0400A) 10.000.10 1.960.05 9.000.10 () 14 8 Center of effective imaging area and center of package ( : Lid's size) 9.000.10 () (Unit : mm) 0.03 Glass Lid 10.000.10 CCD Package 1.390.05 0.03 Cross section A-A' 5.000.075 0.500.50 CCD 1 0.500.50 5.000.075 7 Rotation error of die : = 1.0 MAX. 3.500.30 3.350.10 2.550.10 A 5.02MAX. 1.270.25 A' 0.30TYP. 0.46TYP. 0.25 M 0.250.10 P-1.27TYP. 10.16-0 +0.5 10 0.800.05 () PRECAUTIONS FOR CCD AREA SENSORS PRECAUTIONS FOR CCD AREA SENSORS 1. Package Breakage In order to prevent the package from being broken, observe the following instructions : 1) The CCD is a precise optical component and the package material is ceramic or plastic. Therefore, o Take care not to drop the device when mounting, handling, or transporting. o Avoid giving a shock to the package. Especially when leads are fixed to the socket or the circuit board, small shock could break the package more easily than when the package isn't fixed. 2) When applying force for mounting the device or any other purposes, fix the leads between a joint and a stand-off, so that no stress will be given to the jointed part of the lead. In addition, when applying force, do it at a point below the stand-off part. (In the case of ceramic packages) - The leads of the package are fixed with low melting point glass, so stress added to a lead could cause a crack in the low melting point glass in the jointed part of the lead. Low melting point glass Lead (In the case of plastic packages) - The leads of the package are fixed with package body (plastic), so stress added to a lead could cause a crack in the package body (plastic) in the jointed part of the lead. Glass cap Package Lead Fixed Stand-off 3) When mounting the package on the housing, be sure that the package is not bent. - If a bent package is forced into place between a hard plate or the like, the package may be broken. 4) If any damage or breakage occurs on the surface of the glass cap, its characteristics could deteriorate. Therefore, o Do not hit the glass cap. o Do not give a shock large enough to cause distortion. o Do not scrub or scratch the glass surface. - Even a soft cloth or applicator, if dry, could cause dust to scratch the glass. 2. Electrostatic Damage Fixed Stand-off As compared with general MOS-LSI, CCD has lower ESD. Therefore, take the following anti-static measures when handling the CCD : 1) Always discharge static electricity by grounding the human body and the instrument to be used. To ground the human body, provide resistance of about 1 M$ between the human body and the ground to be on the safe side. 2) When directly handling the device with the fingers, hold the part without leads and do not touch any lead. 11 PRECAUTIONS FOR CCD AREA SENSORS 3) To avoid generating static electricity, a. do not scrub the glass surface with cloth or plastic. b. do not attach any tape or labels. c. do not clean the glass surface with dustcleaning tape. 4) When storing or transporting the device, put it in a container of conductive material. o The contamination on the glass surface should be wiped off with a clean applicator soaked in Isopropyl alcohol. Wipe slowly and gently in one direction only. - Frequently replace the applicator and do not use the same applicator to clean more than one device. Note : In most cases, dust and contamination are unavoidable, even before the device is first used. It is, therefore, recommended that the above procedures should be taken to wipe out dust and contamination before using the device. 3. Dust and Contamination Dust or contamination on the glass surface could deteriorate the output characteristics or cause a scar. In order to minimize dust or contamination on the glass surface, take the following precautions : 1) Handle the CCD in a clean environment such as a cleaned booth. (The cleanliness level should be, if possible, class 1 000 at least.) 2) Do not touch the glass surface with the fingers. If dust or contamination gets on the glass surface, the following cleaning method is recommended : o Dust from static electricity should be blown off with an ionized air blower. For antielectrostatic measures, however, ground all the leads on the device before blowing off the dust. 4. Other 1) Soldering should be manually performed within 5 seconds at 350 C maximum at soldering iron. 2) Avoid using or storing the CCD at high temperature or high humidity as it is a precise optical component. Do not give a mechanical shock to the CCD. 3) Do not expose the device to strong light. For the color device, long exposure to strong light will fade the color of the color filters. 12 |
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